Silicon interposer producing method, silicon interposer and semiconductor device package and semiconductor device incorporating silicon interposer

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United States of America Patent

PATENT NO 7851359
SERIAL NO

12259564

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Abstract

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for plating.

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Patent Owner(s)

  • SHINKO ELECTRIC INDUSTRIES CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sunohara, Masahiro Nagano, JP 136 2485

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