Flexible sized die for use in multi-die integrated circuit

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9026872
APP PUB NO 20140049932A1
SERIAL NO

13587778

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An integrated circuit (IC) structure can include a first die and a second die. The second die can include a first base unit and a second base unit. Each of the first base unit and the second base unit is self-contained and no signals pass between the first base unit and the second base unit within the second die. The IC structure can include an interposer. The interposer includes a first plurality of inter-die wires coupling the first die to the first base unit, a second plurality of inter-die wires coupling the first die to the second base unit, and a third plurality of inter-die wires coupling the first base unit to the second base unit.

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Patent Owner(s)

  • XILINX, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Camarota, Rafael C San Jose, US 51 1566

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