Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 13, 2009
Grant Date -
Jul 14, 2005
app pub date -
Mar 7, 2005
filing date -
Jan 7, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention relates to a recyclable donor wafer that includes a substrate and a formed layer thereon, wherein the formed layer has a thickness sufficient to provide (a) at least two useful layers for detachment therefrom and (b) additional material that can be removed to planarize exposed surfaces of the useful layers prior to detachment from the donor wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully