Surface metallized semiconductors
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United States of America Patent
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Sep 17, 1985
Issued Date -
N/A
app pub date -
Jun 11, 1984
filing date -
Jan 27, 1982
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Expired
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Abstract
The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the I and VIII Secondary Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallization without current.
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