Radiation-sensitive resin composition
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United States of America Patent
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Jan 14, 2003
Grant Date -
Jan 31, 2002
app pub date -
Jun 12, 2001
filing date -
Jun 12, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A positive-type radiation-sensitive resin composition is provided. The composition includes: (A) a low-molecular compound comprising a compound having at least one amino group having one or two hydrogen atom(s) bonded to the nitrogen atom; at least one hydrogen atom the amino group has having been substituted with a t-butoxycarbonyl group; (B) a radiation-sensitive acid generator; and (C) a silicon-atom-containing resin comprising an alkali-insoluble or alkali-slightly-soluble resin having been protected with an acid-cleavable group; the resin being capable of turning soluble in alkali upon cleavage of the acid-cleavable group. This radiation-sensitive resin composition is effectively responsive to radiations of various types, has superior sensitivity and resolution and also a superior long-term storage stability, and is useful as a positive-type chemically amplified resist.
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