Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment
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United States of America Patent
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Jun 24, 2008
Grant Date -
Dec 29, 2005
app pub date -
Jun 27, 2005
filing date -
Jun 28, 2004
priority date (Note) -
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Abstract
After electrode patterning on an electrode forming surface of a piezoelectric substrate 2 (FIG. 1(b)), a conductor layer is formed on an electrode non-forming surface of the piezoelectric substrate 2 (FIG. 1(c)). After forming the conductor layer, the conductor layer formed on the other surface is removed (FIG. 1(f)) after at least one step (FIG. 1(e)), and thereafter, dicing for separation into elements and mounting on a mounting substrate are carried out. By removing all the conductor layer on the other surface of the piezoelectric substrate, the out-of-passband attenuation and isolation performance can be significantly improved.
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