Enhanced underfill adhesion
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 11, 2003
Issued Date -
N/A
app pub date -
Sep 16, 1999
filing date -
Jul 11, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flip chip having a chip passivation layer disposed on a metalization layer. Terminal vias are formed in the passivation layer exposing a portion of the metalization layer and terminal metalization is disposed on the metalization layer at the terminal vias. A stress reducing layer is disposed on the chip passivation layer with underfill apertures formed in the stress reducing layer so as to expose selected portions of the chip passivation layer, thereby enhancing the adhesion of an underfill material to the flip chip.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully