Apparatus for transporting and polishing wafers
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United States of America Patent
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May 16, 2006
Grant Date -
Jul 28, 2005
app pub date -
Dec 2, 2004
filing date -
Dec 3, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of the wafer with respect to the tray on which it is mounted by sensing the position of the sidewall. The present invention also discloses an apparatus for polishing wafers having the apparatus for transporting wafers comprising the circular tray and a plurality of guides and a plurality of sensors above-mentioned.
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