Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11967570
APP PUB NO 20220285297A1
SERIAL NO

17687350

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Abstract

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A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

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Patent Owner(s)

  • MEDIATEK INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chi-Yuan Hsin-chu, TW 48 292
Chen, Tai-Yu Hsin-chu, TW 64 199
Hsu, Chia-Hao Hsinchu, TW 112 581
Hsu, Yao-Pang Hsin-chu, TW 9 13
Lee, Chung-Fa Hsin-chu, TW 8 41
Liu, Hsing-Chih Hsin-chu, TW 25 54
Tsai, Shiann-Tsong Hsin-chu, TW 32 95

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