Low-force electrochemical mechanical processing method and apparatus
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United States of America Patent
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Jul 3, 2007
Grant Date -
Apr 3, 2003
app pub date -
May 23, 2002
filing date -
Sep 28, 2001
priority date (Note) -
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Abstract
The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or holding the workpiece surface and a workpiece-surface-influencing-device (WSID). The WSID is used to uniformly distribute the applied force to the workpiece surface and includes various layers that are used to process and apply a uniform and global force to the workpiece surface.
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