Method of producing hard multilayer film formed material
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United States of America Patent
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Oct 31, 1995
Issued Date -
N/A
app pub date -
Mar 7, 1995
filing date -
Jul 31, 1992
priority date (Note) -
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Abstract
A hard multilayer film structure comprises a titanium-containing compound layer possessing high wear resistance deposited on a substrate and a silicon-containing hard carbon layer possessing self-lubricating properties, high wear resistance and high resistance to heat. Deposition of these layers is effected by the plasma-enhanced chemical vapor deposition technique. As a raw gas for the deposition of silicon-containing hard carbon-layer, the gas containing tetramethyl silane or tetraethyl silane is used. Deposition of the silicon-containing hard carbon layer is carried out at a temperature of not more than 550.degree. C. and a pressure in the range of 0.05 to 0.5 Torr.
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