Shapes-based migration of aluminum designs to copper damascene
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United States of America Patent
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Dec 25, 2007
Grant Date -
Apr 20, 2006
app pub date -
Oct 21, 2005
filing date -
Sep 26, 2000
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Abstract
An interconnect structure, method of fabricating the interconnect structure and method of designing the interconnect structure for use in semiconductor devices. The interconnect structure includes a damascene metal wire having a pattern of dielectric filled holes.
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