High frequency electronic part
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United States of America Patent
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Jul 13, 2010
Grant Date -
May 21, 2009
app pub date -
May 31, 2006
filing date -
Jun 15, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A high frequency electronic part comprising a conductor wiring for transmitting an electric signal of 100 MHz to 100 GHz, and an insulation layer composed of a void containing thermoplastic resin film orientated in at least one direction by stretching. The void containing thermoplastic resin film contains voids in the range between 3% and 45% by volume, the number of voids in a thickness direction of the film is 5 or more, and a ratio of the number of voids to film thickness defined by the following equation is in the range between 0.1 and 10 voids/μm:ratio of the number of voids to film thickness (voids/μm)=the number of voids (voids) in film thickness direction/film thickness (μm).
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