Method of manufacturing semiconductor devices and corresponding device

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United States of America Patent

PATENT NO 11901250
SERIAL NO

17411585

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Abstract

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A semiconductor chip or die is mounted at a position on a support substrate. A light-permeable laser direct structuring (LDS) material is then molded onto the semiconductor chip positioned on the support substrate. The semiconductor chip is visible through the LDS material. Laser beam energy is directed to selected spatial locations of the LDS material to structure in the LDS material a pat gstern of structured formations corresponding to the locations of conductive lines and vias for making electrical connection to the semiconductor chip. The spatial locations of the LDS material to which laser beam energy is directed are selected as a function of the position the semiconductor chip which is visible through the LDS material, thus countering undesired effects of positioning offset of the chip on the substrate.

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Patent Owner(s)

Patent OwnerAddress
STMICROELECTRONICS S R LITALY AGRA BRIANZA AGRATE BRIANZA VARESE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Derai, Michele Milan, IT 19 22
Magni, Pierangelo Villasanta, IT 25 286

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