Method of demounting thin semiconductor devices
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United States of America Patent
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Aug 22, 2023
Grant Date -
N/A
app pub date -
Aug 20, 2021
filing date -
Aug 21, 2020
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Abstract
The described method enables removal of any flexible material from a temporary carrier for transfer to another surface. In particular, a semiconductor wafer is commonly held by a temporary adhesive to a carrier substrate for support during a variety of processing steps, including thinning of the semiconductor device layer. Subsequent to processing, the described method attaches the ultra-thin device layer to a roll of tape for removal from the temporary adhesive, followed by transfer to a demount roller, which then releases it onto a desired permanent surface. Utilizing the flexible nature of the ultra-thin device layer, the sequence of rollers is able to peel it from the temporary adhesive without any need for laser release processing or chemical adhesive removal while maintaining the thinned wafer in a planar form during processing. This transfer supports operations that include a change of orientation, such as from face up to face down.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- AMERICAN SEMICONDUCTOR, INC.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hackler,, Sr Douglas R | Boise, US | 14 | 304 |
Parker, Randall S | Boise, US | 5 | 28 |
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