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United States of America Patent

PATENT NO 11837533
SERIAL NO

17402894

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Abstract

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A semiconductor package including: a first substrate including a first surface including a first region and a second region at least partially surrounding the first region, wherein the first substrate includes a first insulating layer, a first conductive pattern in the first insulating layer, a first passivation layer disposed in the first region and the second region, and a second passivation layer disposed on the first passivation layer in the second region; an interposer overlapping the first substrate and including a second insulating layer and a second conductive pattern in the second insulating layer; a first connection terminal disposed on the first passivation layer in the first region; and a second connection terminal disposed on the second passivation layer in the second region, wherein the first conductive pattern and the second conductive pattern are connected to each other through the first connection terminal and the second connection terminal.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Dong Ho Hwaseong-si, KR 113 456
Lee, Jang Woo Asan-si, KR 60 440

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