Encapsulation for particle entrapment
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United States of America Patent
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Jun 12, 2007
Grant Date -
Dec 15, 2005
app pub date -
Sep 30, 2004
filing date -
Nov 5, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A packaged micromechanical device (100) having a blocking material (116) encapsulating debris-generating regions thereof. The blocking material (116) prevents the generation of debris that could interfere with the operation of the micromechanical device (100). Debris-generating regions of the device (100), including debris-creating sidewalls and any debris-harboring cavities, as well as electrical connections (108) linking the device (100) to the package substrate (102) are encapsulated by the blocking material (116). The blocking material (116) avoids contact with any debris-intolerant regions (118) of the device (100). A package lid (124), which is glass in the case of many DMD packages, seals the device (100) in a package cavity (120).
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