Low stress die attachment
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United States of America Patent
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Mar 1, 2005
Grant Date -
N/A
app pub date -
Jan 22, 2002
filing date -
Mar 17, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.
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