Headset interface assembly
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United States of America Patent
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-
Sep 5, 1995
Grant Date -
N/A
app pub date -
Nov 1, 1993
filing date -
Nov 1, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interface assembly for providing an electrical and mechanical interface between a headset and a headset amplifier, includes a transmit signal path for receiving a signal from the headset microphone and for providing an output signal having electrical characteristics compatible with the headset amplifier. The interface assembly also includes a receive signal path for receiving a signal from the headset amplifier and for providing a signal having electrical characteristics compatible with the headset coupled thereto. Compatibility from headset to headset amplifier may be achieved by adjusting one or more characteristics including but not limited to the frequency response, input/output impedance matching, level adjustment and RFI suppression. Compatibility from headset amplifier to headset may be achieved by adjusting one or more characteristics including but not limited to sound pressure protection, frequency response shaping, input/output impedance matching, level adjustment, ground isolation and RFI suppression.
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