Processing device and processing method

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United States of America Patent

PATENT NO 10442032
APP PUB NO 20170182590A1
SERIAL NO

15300207

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI HEAVY INDUSTRIES LTD2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 100-8332

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goya, Saneyuki Tokyo, JP 47 191
Ishide, Takashi Tokyo, JP 22 337
Muta, Kenji Tokyo, JP 22 120
Watanabe, Toshiya Tokyo, JP 73 2115

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