Physically deposited layer to electrically connect circuit edit connection targets
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United States of America Patent
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Aug 1, 2006
Grant Date -
Nov 6, 2003
app pub date -
May 28, 2003
filing date -
Apr 5, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed is a layer to electrically connect targets during a circuit edit of an integrated circuit and systems and methods for forming the layer. The layer contains a conductive material, such as gold or another metal, which has been physically deposited by sputtering, thermal evaporation, and other physical deposition technique.
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