Method for thermally treating substrates
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United States of America Patent
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Jul 19, 2005
Grant Date -
Oct 7, 2004
app pub date -
Nov 28, 2001
filing date -
Dec 1, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.
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