Semiconductor device and a manufacturing method of the same

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Jul 19, 2011
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Feb 15, 2007
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Jul 10, 2006
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Jul 11, 2005

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Abstract

The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at. can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

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RENESAS ELECTRONICS CORPORATION

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Kawanabe, Naoki	Tokyo, JP	11	83
Muto, Nobuyasu	Tokyo, JP	6	34
Ono, Hiroshi	Tokyo, JP	370	4183
Wada, Tamaki	Tokyo, JP	97	2047

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Semiconductor device and a manufacturing method of the same

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United States of America Patent

11482854

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PATENT NO	7981788
APP PUB NO	20070035002A1
SERIAL NO	11482854
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
July 19, 2011	US,7981788,B2 US7981788B2	GRANTED PATENT AS SECOND PUBLICATION
February 15, 2007	US,20070035002,A1 US20070035002A1	FIRST PUBLISHED PATENT APPLICATION

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11482854

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