External contact element for a power semiconductor module and power semiconductor module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11810889
APP PUB NO 20220278070A1
SERIAL NO

17676350

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An external contact element for a power semiconductor module includes a bonded blank strip, the bonded blank strip being formed such that the external contact element includes: a first contact portion configured to be coupled to the power semiconductor module by a first solder joint, a second contact portion spaced from the first contact portion in a thickness direction out of the plane of the first contact portion, the second contact portion being configured to be coupled to an external appliance, and a spring portion connecting the first and second contact portions to each other and configured to compensate a movement along the thickness direction. The bonded blank strip includes a first sheet of a first metal or first metal alloy and a second sheet of a different second metal or second metal alloy. The second sheet is omitted from at least a substantial part of the first contact portion.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGAM CAMPEON 1-15 NEUBIBERG 85579

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koch, Christoph Salzkotten, DE 44 354
Uhlemann, Andre Wickede, DE 14 374

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