Poly(amic acid) solution and polyimide film or polymide-coated material obtained therefrom

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United States of America Patent

PATENT NO 5719253
SERIAL NO

08539740

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Abstract

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This invention provides a poly(amic acid) solution which does not contain aprotic polar solvents such as DMF, NMP, DMAc, DMSO, as well as a polyimide film obtained therefrom having appropriate flexibility and a small coefficient of linear thermal expansion and a coated material in which the polyimide film is formed on a substrate. More particularly, it provides a poly(amic acid) solution which has an aromatic poly(amic acid) and a tertiary amine as the solute and a water soluble alcohol compound and/or a water soluble ether compound as the solvent and contains substantially no aprotic polar solvent, as well as a polyimide film obtained from the poly(amic acid) solution and a coated material obtained by forming the film on a substrate.

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Patent Owner(s)

  • UNITIKA LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Echigo, Yoshiaki Kyoto, JP 46 448
Iwaya, Yoshiaki Kyoto, JP 6 89
Okamoto, Shoji Kyoto, JP 32 253
Tomioka, Isao Kyoto, JP 12 105
Yamada, Hiroshi Kyoto, JP 691 7950

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