Semiconductor package assembly and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11778727
APP PUB NO 20230066017A1
SERIAL NO

17461947

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Abstract

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A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jian-Ting Hsinchu County, TW 12 40
Lu, Cheng-Wei Hsinchu, TW 14 14
Wang, Kuang-Hua Hsinchu, TW 6 0

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