Substrate processing method and substrate processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11905603
SERIAL NO

17553971

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Abstract

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A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyamoto, Isamu Kumamoto, JP 18 160
Nakamizo, Kenji Kumamoto, JP 11 16
Nakazawa, Takashi Kumamoto, JP 82 1022
Satake, Keigo Kumamoto, JP 27 80

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