Systems and methods for semi-flexible eutectic bonder piece arranegments

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11211354
APP PUB NO 20190164929A1
SERIAL NO

16203366

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Abstract

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In an embodiment, a system includes: a circular frame comprising a first side and a second side opposite the first side, wherein the circular frame comprises an aperture formed therethrough; an insert disposed within the aperture; a first wafer disposed over the insert; a second wafer disposed over the first wafer, wherein both the first wafer and the second wafer are configured for eutectic bonding when heated; two clamps disposed on the first side along the circular frame, wherein the two clamps are configured to contact the second wafer at respective clamp locations; and a plurality of pieces configured to secure the insert within the aperture, the plurality of pieces comprising both fixed and flexible pieces, the plurality of pieces comprising two fixed pieces disposed respectively adjacent to the clamp locations along the second side of the circular frame.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chih-Hang Taoyuan, TW 11 17
Chou, Yin-Tun Hsinchu, TW 16 4
Huang, Richard Hsinchu, TW 58 1165
Liu, Jen-Hao Miaoli County, TW 35 136
Wang, I-shi Taipei County, TW 32 72

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