Semiconductor device and semiconductor device manufacturing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jan 16, 2007
Grant Date -
Feb 3, 2005
app pub date -
Aug 31, 2004
filing date -
Apr 27, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a semiconductor device including a semiconductor wafer having a first main surface where a circuit element is formed, electrode pads are formed at an upper portion of the first main surface of the semiconductor wafer electrically connected with the circuit element. Index marks are formed on a second main surface of the semiconductor wafer that is opposite the first main surface. The index marks consist of line segments and indicate a direction along which the semiconductor device is to be mounted.
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