Semiconductor package and method of manufacturing semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11894242
APP PUB NO 20230223279A1
SERIAL NO

18174576

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Abstract

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A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, a molding member on the package substrate to cover at least a portion of the semiconductor chip, and a mechanical reinforcing member provided around the semiconductor chip within the molding member and extending in at least one direction.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677 REPUBLIC OF KOREA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahn, Jinchan Hwaseong-si, KR 9 10
Kim, Taeyoung Suwon-si, KR 213 1690
Kim, Wonyoung Seoul, KR 24 278
Kwon, Seokhong Hwaseong-si, KR 2 0

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