Method and structure for measuring a bonding resistance
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United States of America Patent
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Oct 31, 2006
Issued Date -
N/A
app pub date -
Apr 27, 2006
filing date -
May 24, 2004
priority date (Note) -
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Abstract
A structure and a method for measuring the bonding resistance are provided. The structure for measuring a bonding resistance between a first object and a second object is provided, wherein the first object has a plurality of first pins and a reference pin, and the second object has a plurality of second pins corresponding to the plurality of first pins and the reference pin. The structure further includes a first circuit formed by electrically connecting the reference pin to the first pin adjacent to the reference pin in a first direction, and a second circuit formed by electrically connecting a second pin corresponding to the reference pin to the adjacent second pin in a second direction. By connecting the first and the second circuits in series, the value of the bonding resistance is easily measured.
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