Leadless plastic chip carrier with etch back pad singulation
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United States of America Patent
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Sep 18, 2007
Grant Date -
N/A
app pub date -
May 6, 2005
filing date -
Jun 10, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.
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