Cavity-down ball grid array package with semiconductor chip solder ball
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United States of America Patent
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Nov 18, 2003
Grant Date -
Aug 7, 2003
app pub date -
Jun 14, 2002
filing date -
Feb 5, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A cavity-down ball grid array package includes a substrate having a through cavity provided therein. A heat sink is attached to the substrate and a semiconductor chip in the cavity is attached to the heat sink and electrically connected to the substrate. A ball grid array is on the substrate and on the semiconductor chip.
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