Power delivery for embedded bridge die utilizing trench structures

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11817391
APP PUB NO 20230238332A1
SERIAL NO

18128960

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Abstract

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Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, an interconnect bridge embedded in the substrate, and at least one vertical interconnect structure disposed through a portion of the interconnect bridge, wherein the at least one vertical interconnect structure is electrically and physically coupled to the die.

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Patent Owner(s)

  • INTEL CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aygun, Kemal Tempe, US 121 654
Qian, Zhiguo Chandler, US 85 613
Xie, Jianyong Chandler, US 42 105

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