Integrated circuit package system with external interconnects within a die platform
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United States of America Patent
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Jan 4, 2011
Issued Date -
N/A
app pub date -
Feb 22, 2008
filing date -
Feb 22, 2008
priority date (Note) -
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Abstract
The present invention provides an integrated circuit package system comprising: attaching a die platform to an integrated circuit die; mounting the integrated circuit die over an external interconnect with a bottom side of the external interconnect partially within the die platform; connecting the integrated circuit die and the external interconnect; and forming an encapsulation over the integrated circuit die with the external interconnect partially exposed.
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