Packaging process tools and systems, and packaging methods for semiconductor devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9543185
APP PUB NO 20130143361A1
SERIAL NO

13309311

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Ming-Da Jhubei, TW 409 4313
Huang, Kuei-Wei Hsin-Chu, TW 69 1167
Lin, Chih-Wei Xinfeng Township, TW 336 4562
Lin, Chun-Cheng New Taipei, TW 96 1362
Lin, Wei-Hung Xinfeng Township, TW 161 1471
Liu, Chung-Shi Hsin-Chu, TW 773 10176

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 10, 2024
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 10, 2028
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00