Method for measuring elastic properties

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United States of America Patent

PATENT NO 6883367
APP PUB NO 20030094034A1
SERIAL NO

10300323

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Abstract

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This invention relates to a method for measuring elastic modulus of a sample object. This invention also relates to a method for correcting creep effects in the modulus measurement. The error due to creep in the apparent contact compliance is equal to the ratio of the indenter displacement rate at the end of the load hold to the unloading rate. Determination of this error term and deduction of it from the measured contact compliance can be easily done at a low cost by modifying the data analysis software in any commercial depth-sensing indentation system.

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Patent Owner(s)

  • CITY UNIVERSITY OF HONG KONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Gang Mountain View, CA 25 94
Ngan, Alfonso Hing Wan Hong Kong, CN 3 10

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