Interconnect structure of semiconductor integrated circuit and semiconductor device including the same
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United States of America Patent
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Jul 16, 2013
Grant Date -
Oct 27, 2011
app pub date -
Jun 27, 2011
filing date -
Feb 10, 2009
priority date (Note) -
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Abstract
In a semiconductor integrated circuit chip including an interconnect layer in which there is a limitation on the lengths of interconnects or areas occupied by the interconnects, empty spaces between power supply interconnect segments having the same potential located in parallel to a priority interconnect direction, are shifted relative to each other within the limits of the lengths and areas of power supply interconnects. As a result, a local increase in resistance is dispersed, whereby an influence on a voltage drop is reduced.
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