Skip via connection between metallization levels

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11315827
APP PUB NO 20210280456A1
SERIAL NO

16813162

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Abstract

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A method for fabricating a semiconductor device including a skip via connection between metallization levels includes subtractively etching first conductive material to form a first via and a skip via on a first conductive line. The first via and the first conductive line are included within a first metallization level. The skip via is used to connect the first metallization level to a third metallization level above a second metallization level. The method further includes forming, on the first via from second conductive material, a second via disposed on a second conductive line. The second via and the second conductive line are included within the second metallization level.

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Patent Owner(s)

  • IBM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clevenger, Lawrence A Saratoga Springs, US 715 4465
Huang, Huai Saratoga, US 106 164
Lanzillo, Nicholas Anthony Troy, US 121 29
Penny, Christopher J Saratoga Springs, US 176 1503
Shobha, Hosadurga Niskayuna, US 98 467

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