Semiconductor device plastic jacket having first and second annular sheet metal strips with corrugated outer edges embedded in said plastic jacket
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 16, 1980
Grant Date -
N/A
app pub date -
Mar 12, 1979
filing date -
Mar 10, 1978
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high performance, wafer-shaped semiconductor device of the type including a wafer-shaped semiconductor element, a pair of electrodes located on the surfaces of the element, a pair of cylindrical metal bodies contacting the electrodes, an insulating ring enclosing and centering the metal bodies and the semiconductor element and a plastic jacket surrounding the insulating ring for tightly encasing the semiconductor device. In addition, there is provided a pair of annular sheet metal strips each of which has an inner edge region fastened to one of the cylindrical metal bodies and a corrugated chemically roughened outer edge region which is embedded in the plastic jacket. A powder coating is applied to the chemically roughened outer edge region for the purpose of providing a pressure and oil-tight housing for the semiconductor device.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully