Vertically integrated sensor structure and method
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United States of America Patent
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Feb 4, 1997
Issued Date -
N/A
app pub date -
Jul 22, 1996
filing date -
Sep 5, 1995
priority date (Note) -
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Abstract
A vertically integrated sensor structure (60) includes a base substrate (71) and a cap substrate (72) bonded to the base substrate (71). The base substrate (71) includes a transducer (78) for sensing an environmental condition. The cap substrate (72) includes electronic devices (92) formed on one surface to process output signals from the transducer (78). The sensor structure (60) provides an integrated structure that isolates sensitive components from harsh environments.
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