Semiconductor device and manufacturing method of semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11328998
APP PUB NO 20210082820A1
SERIAL NO

17022737

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Abstract

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A semiconductor device includes: a first semiconductor element having a first electrode on a main surface side thereof and a second electrode on a back surface side thereof; a base material provided with a connection conductor connected to the first electrode; a sealing resin provided on the base material to seal the first semiconductor element; and a first via provided in the sealing resin and electrically connected to the second electrode of the first semiconductor element.

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Patent Owner(s)

  • AOI ELECTRONICS CO. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wakisaka, Shinji Hanno, JP 37 761

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