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United States of America Patent

PATENT NO 11810857
SERIAL NO

17001917

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Abstract

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A structure includes a first conductive feature in a first dielectric layer; a second dielectric layer over the first dielectric layer; and a second conductive feature extending through the second dielectric layer to physically contact the first conductive feature, wherein the second conductive feature includes a metal adhesion layer over and physically contacting the first conductive feature; a barrier layer extending along sidewalls of the second dielectric layer; and a conductive filling material extending over the metal adhesion layer and the barrier layer, wherein a portion of the conductive filling material extends between the barrier layer and the metal adhesion layer.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Wei-Hsiang Hsinchu, TW 2 0
Chang, Chih-Yi New Taipei, TW 17 54
Hsieh, Ming-Hsiao Hsinchu, TW 10 19
Huang, Chien Chung Taichung, TW 23 27
Kuo, Chia-Pang Taoyuan, TW 20 24
Lee, Ya-Lien Baoshan Township, TW 50 517
Lin, Chun-Chieh Taichung, TW 132 1257
Su, Hung-Wen Jhubei, TW 108 1222

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