Package structure and method for forming the same
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United States of America
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Jan 7, 2020
Grant Date -
Jun 14, 2018
app pub date -
Jul 3, 2017
filing date -
Jul 3, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
Package structures and methods for forming the same are provided. A fan-out package structure includes a semiconductor substrate. The package structure also includes a connector over a top surface of the semiconductor substrate. The package structure further includes a buffer layer surrounding the connector and overlying a sidewall of the semiconductor substrate. In addition, the package structure includes an encapsulation layer surrounding the buffer layer. The buffer layer is between the encapsulation layer and the sidewall of the semiconductor substrate. The package structure also includes a redistribution layer (RDL) over the buffer layer and the encapsulation layer. The redistribution layer is electrically connected to the connector.
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