Wafer level packaging of MEMS

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United States of America Patent

PATENT NO 9630835
SERIAL NO

14467616

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Abstract

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A MEMS device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of MEMS devices, and patterning the lower polymer film to form a headspace wall surrounding components of each MEMS device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form headspace caps which isolate the components of each MEMS device. Subsequently, the MEMS devices are singulated to provide separate MEMS devices.

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Patent Owner(s)

  • TEXAS INSTRUMENTS INCORPORATED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jacobsen, Stuart M Frisco, US 35 753
Shih, Wei-Yan Plano, US 30 414

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