Microelectronic packages having a die stack and a device within the footprint of the die stack
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United States of America Patent
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Dec 19, 2023
Grant Date -
N/A
app pub date -
Feb 25, 2022
filing date -
Apr 26, 2016
priority date (Note) -
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Abstract
A microelectronic package may be fabricated having a microelectronic die stack attached to a microelectronic substrate and at least one microelectronic device, which is separate from the microelectronic die stack, attached to the microelectronic substrate within the footprint of one of the microelectronic dice within the microelectronic die stack. In one embodiment, the microelectronic die stack may have a plurality of stacked microelectronic dice, wherein one microelectronic die of the plurality of microelectronic dice has a footprint greater than the other microelectronic die of the plurality of microelectronic dice, and wherein the at least one microelectronic device is attached to the one microelectronic die of the plurality of microelectronic dice having the greater footprint.
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