Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion

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United States of America Patent

PATENT NO 11735550
SERIAL NO

17555854

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Abstract

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Various embodiments of the present disclosure are directed towards a semiconductor structure including a bond bump disposed on an upper surface of an upper conductive structure. The upper conductive structure overlies a substrate. A buffer layer is disposed along the upper surface of the upper conductive structure. The bond bump comprises a sidewall having a straight sidewall segment overlying a curved sidewall segment.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chu, Ching-Sheng Baoshan Township, TW 12 34
Hsu, Chern-Yow Chu-Bei, TW 134 734

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