Semiconductor package with three leads
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United States of America Patent
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Jun 27, 2023
Grant Date -
Jan 14, 2021
app pub date -
Sep 5, 2017
filing date -
Sep 5, 2017
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor device is provided, including a seal portion; an electronic element within the seal portion; first, second, and third lead terminals; first and second connecting elements; and first and second conductive bonding agents, one end of the first connecting element having a protrusion downward and electrically connected to a control electrode of the electronic element with the first conductive bonding agent, a first side surface extending from the one end to the other end of the first connecting element is parallel to an extending direction along which the one end of the second connecting element extends, a wall portion being disposed on a top surface of the one end of the second lead terminal, and the wall portion being in contact with the other end of the first connecting element.
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