Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor

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United States of America Patent

PATENT NO 11697888
APP PUB NO 20220282394A1
SERIAL NO

17750733

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Abstract

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Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.

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Patent Owner(s)

  • APPLIED MATERIALS INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bergman, Eric J Kalispell, US 93 1836
Crane, Stuart Kalispell, US 7 79
Stolt, Timothy G Kalispell, US 3 0
Youngbull, Tricia A Whitefish, US 7 24

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