Reflective and heat-insulating QLED package device and method for packaging the same as well as luminaire

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11316088
APP PUB NO 20210367126A1
SERIAL NO

16322137

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Abstract

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A reflective and heat-insulating QLED package device and a method for packaging the same as well as a luminaire are provided. The reflective and heat-insulating QLED package device includes a substrate, a first LED chip for emitting blue light, a second LED chip for emitting green light, an adhesive layer for quantum dots, a reflecting layer for changing the path of light rays, and a heat-insulating layer. The first LED chip and the second LED chip are arranged on the substrate in a tiled manner. The heat-insulating layer is arranged on the light output surface of the first LED chip and the second LED chip, a reflecting layer covers the heat-insulating layer, and a reflecting substance or a refractive substance is uniformly distributed in the reflecting layer. The adhesive layer for quantum dots covers the reflecting layer and is covered by a moisture and oxygen blocking adhesive layer.

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Patent Owner(s)

  • TIANJIN ZHONGHUAN ELECTRONIC LIGHTING TECHNOLOGY CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hong, Jianming Tianjin, CN 2 25
Li, Chunfeng Tianjin, CN 7 149
Li, Dong Tianjin, CN 537 7592
Tang, Xiumei Tianjin, CN 1 2

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